Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device

ABSTRACT

A heat-dissipating device and a method for manufacturing a housing of the heat-dissipating device have been proposed. A metal plate is stamped to form a blank plate having a central area with a first set of fins, a second set of fins, and a number of assembly holes. The blank plate is further pressed to make the first set of fins and the second set of fins extend upright relative to the central area and surround the central area. The assembly holes allow the housing to be engaged by fasteners to a mounting plate with a fan.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a heat-dissipating device and a method for manufacturing a housing for the heat-dissipating device. More particularly, the present invention relates to a heat-dissipating device for dissipating heat generated by a central processing unit (CPU) or electric elements, such that the heat-dissipating device and the housing thereof can be manufactured and processed easily, thereby reducing the manufacturing cost.

[0003] 2. Description of the Related Art

[0004]FIG. 1 of the drawings illustrates a conventional housing 90 for a heat-dissipating device for CPUs. The housing is made of metal of excellent thermal-conductivity (e.g., aluminum) by extruding to form a strip. The strip is cut to form a blank housing which is then cut to form a plurality of fins 91 spaced by slits (not labeled). The housing 90 is cut in the central area to form an opening 92. Bolts or screws are threaded into the space area between the fins 91, so as to engage the housing 90 with a mounting plate having a fan mounted thereon. Manufacture of such housing 90 is complicated and costly.

[0005]FIG. 2 of the drawings illustrates another conventional housing 80 for a heat-dissipating device for CPUs. The housing 80 is formed from metal by casting to provide ears 81 extended outward from the housing 80 for assembly purpose. The manufacturing cost for the housing 80 is even higher than that for the above-mentioned housing 90.

SUMMARY OF THE INVENTION

[0006] It is a primary object of the present invention to provide a heat-dissipating device and a method for manufacturing a housing of the heat-dissipating device such that the heat-dissipating device and the housing thereof can be manufactured and processed easily, thereby reducing the manufacturing cost.

[0007] In accordance with the present invention, a metal plate of excellent thermal-conductivity (e.g., aluminum, copper, etc) is treated with two-stage stamping (two stamping steps) to form a housing of a heat-dissipating device. The housing includes fins and assembly holes after the two-stage stamping.

[0008] Other objects, specific advantages, and novel features of the invention will become more apparent from the following detailed description and preferable embodiments when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]FIG. 1 is a perspective view of a conventional housing for a heat-dissipating device.

[0010]FIG. 2 is a perspective view of another conventional housing for a heat-dissipating device.

[0011]FIG. 3 is a perspective view of a blank plate after a first stage stamping, of a first embodiment of a housing for a heat-dissipating device in accordance with the present invention.

[0012]FIG. 4 is a perspective view of the first embodiment of the housing, after a second stage stamping, for a heat-dissipating device in accordance with the present invention.

[0013]FIG. 5 is a perspective view of a second embodiment of the housing for a heat-dissipating device in accordance with the present invention.

[0014]FIG. 6 is a perspective view of a third embodiment of the housing for a heat-dissipating device in accordance with the present invention.

[0015]FIG. 7 is a perspective view of a blank plate after a first stage stamping, of a fourth embodiment of the housing for a heat-dissipating device in accordance with the present invention.

[0016]FIG. 8 is a perspective view of the fourth embodiment of the housing, after a second stage stamping, for a heat-dissipating device in accordance with the present invention.

[0017]FIG. 9 is an exploded perspective view of a heat-dissipating device in accordance with the present invention having the first embodiment of the housing.

[0018]FIG. 10 is a top view of the heat-dissipating device in accordance with the present invention.

[0019]FIG. 11 is a sectional view taken along line 11-11 in FIG. 10.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The present invention will be described below with reference to FIGS. 3 through 11.

[0021] The method for manufacturing a housing for a heat-dissipating device includes two stamping steps. Referring to FIG. 3, in the first stamping step, a metal plate of excellent thermal-conductivity (e.g., aluminum, copper, etc) is stamped to form a blank plate 10 having a central area 11 with a first set of fins 12 formed on two opposite sides of the central area 11, a second set of fins 13 formed on the other two sides of the central area 11, and a number of assembly holes 14. Each two adjacent fins 12, 13 have a slit 15 therebetween.

[0022] Referring to FIG. 4, in the second stamping step, the blank plate 10 is further stamped to make the first set of fins (now designated by 22) and the second set of fins (now designated by 23) extend upright relative to the central area (now designated by 21) and surround the central area 21. The slit (now designated by 25) between each two adjacent fins 22, 23 provides a channel for air ventilation purpose. The fins 22 and 23 may have different heights, e.g., the fins 23 may be lower than the fins 22 for mounting a mounting plate 30 (FIG. 9) thereon.

[0023] As shown in FIGS. 9 through 11, the assembly holes (now designated by 24) allow the mounting plate 30 to be mounted to the housing (now designated by 20) by fasteners 32, the mounting plate 30 having a fan 31 mounted in a center thereof. Thus, assembly of a heat-dissipating device in accordance with the present invention is accomplished. It is noted that the fasteners 32 integral with the mounting plate 30 may be replaced by fasteners of any other type (e.g., conventional bolts or screws). The mounting plate 30 is mounted on top of the lower fins 23 such that the fan 31 is received in a central area 21, the air blowing on the central area 21 and fins 22, 23 around four sides for dissipating heat.

[0024]FIG. 5 illustrates a second embodiment of the housing in accordance with the present invention, wherein two ears 26 (constructed by two of the fins 12 or 13) are formed during the first stamping step, each ear 26 having an assembly hole 24. The ears 26 are preserved after the second stamping step. Namely, the ears 26 are not pressed to be upright relative to the central area 21. Thus, the ears 26 are remained outside the other fins 22 and 23. Preferably, the ears 26 are located at two opposite sides of the housing 20.

[0025]FIG. 6 illustrates a third embodiment of the housing in accordance with the present invention, wherein four ears 26 (constructed by four of the fins 22 and 23) are formed during the first stamping step, each ear 26 having an assembly hole 24. The ears 26 are preserved after the second stamping step. Namely, the ears 26 are not pressed to be upright relative to the central area 21. Thus, the ears 26 are remained outside the other fins 22 and 23. The ears 26 are located at four sides of the housing 20, respectively. Alternatively, the ears 26 may be located at two opposite sides of the housing 20. Both cases may serve the assembly purpose.

[0026] Referring to FIG. 7, in a first stamping step for manufacturing a fourth embodiment of the housing in accordance with the present invention, a metal plate of excellent thermal-conductivity (e.g., aluminum, copper, etc) is stamped to form a blank plate 10 having a central area 11 with a first set of fins 12 formed on two opposite sides of the central area 11 and a second set of fins 13 formed on the other two sides of the central area 11. Each two adjacent fins 12, 13 have a slit 15 therebetween. In this embodiment, the central area 11 has a plurality of through-holes 16 or the slits 15 are extended into the central area 11. Thus, after the second stamping step, the central area (now designated by 21) is provided with through-holes (now designated by 27) or slots 28 defined by the extended portions of the slits (now designated by 25). Through-holes 27 or slots 28 may increase the heat-dissipating effect of housing 20.

[0027] According to the above description, it is appreciated that the housing of the heat-dissipating device in accordance with the present invention can be manufactured by means of two stamping steps, which is extremely simple to proceed with. The production speed is largely improved and the manufacturing cost for the heat-dissipating device is minimized.

[0028] Although the invention has been explained in relation to its preferred embodiment as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention. It is, therefore, contemplated that the appended claims will cover such modifications and variations that fall within the true scope of the invention. 

What is claimed is:
 1. A heat-dissipating device comprising: a housing formed by means of stamping a metal plate, the housing including a central area and a plurality of fins, the fins being formed by means of bending the metal plate, each two adjacent fins having a slit therebetween to provide a channel for air ventilation purpose; and a mounting plate having a fan mounted thereon, the mounting plate being secured to the housing.
 2. The heat-dissipating device as claimed in claim 1 , wherein the housing comprises at least one assembly hole for engaging with the mounting plate by a fastener.
 3. The heat-dissipating device as claimed in claim 1 , wherein the central area of the housing includes a plurality of through-holes.
 4. The heat-dissipating device as claimed in claim 1 , wherein the central area of the housing includes a plurality of slots.
 5. The heat-dissipating device as claimed in claim 1 , wherein the housing comprises at least one outwardly extending ear having an assembly hole therein.
 6. The heat-dissipating device as claimed in claim 1 , wherein the fins on two opposite sides of the housing are lower than the fins on the other two opposite sides of the housing.
 7. A method for manufacturing a housing of a heat-dissipating device, comprising the steps of: forming a blank plate by means of stamping a metal plate, the blank plate including a central area, a first set of fins, and a second set of fins, each two adjacent said fins having a slit therebetween; and stamping the blank plate to make the first set of fins and the second set of fins extend upright relative to the central area and surround the central area.
 8. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 7 , wherein the first set of fins is located on two opposite sides of the central area and the second set of fins is located on the other two opposite sides of the central area.
 9. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 7 , wherein the first set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.
 10. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 8 , wherein the first set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.
 11. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 7 , wherein the second set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.
 12. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 8 , wherein the second set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.
 13. The method for manufacturing a housing of a heat-dissipating device as claimed in claim 8 , wherein the fins on said two opposite sides of the housing lower than the fins on the other two opposite sides of the housing.
 14. The heat-dissipating device as claimed in claim 7 , wherein the central area of the housing includes at least one assembly hole.
 15. The heat-dissipating device as claimed in claim 7 , wherein the central area of the housing includes a plurality of through-holes.
 16. The heat-dissipating device as claimed in claim 7 , wherein the central area of the housing includes a plurality of slots. 